Minutes of IEEE DASC P1076.1.1 Meeting at DAC'02 Attendees: Richard Shi University of Washington shi@ee.washington.edu Alan Mantooth University of Arkansas mantooth@eng.uark.edu Peter Schwarz Fraunhofer Inst. Dresden Schwarz@eas.iis.fhg.de Mark Zwolinski Univ. of Southampton mz@ecs.soton.ac.uk Adam Morawiec ECSI adam.Morawiec@ecsi.org Peter Ashenden Ashenden Designs peter@ashenden.com.au John Shields Synopsys john.shields@synopsys.com Paul Menchini Menchini & Associates mench@mench.com Greg Peterson University of Tennessee gdp@utk.edu 1. Meeting started at 2pm. 2. Alan presented an update on the status and schedule of the group. 3. Alan called the technical discussions on the following open issues: a. packaging the packages i. combine all to one (Peter Wilson, Mark Zwolinski) 1. disadvantages (maintanence) 2. advantages: easy to use; easy to ensure interoperability; ii. why separate packages (Paul,...)? 1. Use names in the domain it likes; hard to please everyone. 2. Use electrical.all or thermal.all (resistance..) 3. hard to ensure Interoperability 4. Choose to use different packages for different applications (Paul Menchini) for emerging applications; hard to do it in one package. iii. (John Sheilds): what packages to include (to support separate packages; maintainability by having people from different areas; addressing issues in their particular areas; iv. A motion to accept different packages (with the ideas of not overloading names; for example, thermal resistance and more issues) and interoperability issues b. MMF units i. Alan summarized the issues on MMF units. ii. Discussions iii. Peter suggested investigating other standards on units. Paul mentioned there is no IEEE standard 100 (as a resource); go with IEEE recommendation (SCC14 responsible for IEEE 100). iv. Action Item: Alan to contact SCC14 chair with the help from Paul c. Remove material properties (e.g. permittivity of SiO2) i. Alan summarized the issue: where it goes, numbers can be different dependent upon how it is extracted, etc. ii. Paul suggested to have a standard name (deferred constant): to give a value at the package body (elaborated at the implementation); iii. Greg re-stated that the users want to have their values; iv. Paul: is there any issue or need to standardize the constant names? If they are not central (converters, interface...), users need to supply values. Then cannot go to IEEE standard. The fundamental issue is there is a value to standardize the names. v. Maybe fundamental constant package (charge, etc...) vi. Questions: deferred constant packages can be changed by users; fundamental constant packages go to IEEE; vii. John: is there any significance of having a separate fundamental constant package? (Paul and Mark) other folks may need to use it too; so a separate package would be reusable. viii. Can put the fundamental constants in a package in lib IEEE - but not in the standard natures package - to allow use for VHDL & VHDL-AMS as well as for use in a physical constants package that would include deferred constants that users can provide with values. ix. Would need a new library with a standard package with the names of deferred constants for physical constants. x. All the prefixes such as mega, kilo, milli, etc. should be included in the fundamental packages. d. Fluidic systems deemed inappropriate for biofluidics - folks at CMU and Duke will help with this. e. Thermal and radiant packages need attention - need someone for radiant packages - Mark Z. will help with lining up folks to check with this. f. Check on the capitalization of units - check with Bruce. g. Address thermal resistance, capacitance - invent thermal inductance h. Why use MOMENT_I? How about ANGULAR_ACCEL not spelled out? Is there a magnetic moment? i. MMOMENT_I type error j. Why use TRANSLATIONAL_V instead of TRANSLATIONAL_VELOCITY? Perhaps use an alias to let users use either spelling... (?) k. FORCE_VECTOR is defined twice. Need to create a FORCE_V_VECTOR for translational velocity. Same thing with torque l. Next meeting: FDL 2002 (Sept 24-27) in Marseille.